Design rules for high-current conductor tracks
These rules apply to the design of HSMtec printed circuit boards to note:
Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for copper cross-sections with copper profiles and currents up to 400 A
Basic rule for current carrying capacity: For each copper profile of its width, the conductor track must be 1 mm wider all round. Example: An 8 mm copper profile requires a 10 mm wide conductor track.
The copper profiles must not be placed on adjacent layers.
A potential-independent copper support of at least the same size must be provided on the opposite FR4 core side of the copper element. This copper layout is potential-independent and serves as a clear support for the copper profile for ultrasonic welding.
For economic reasons, the high-current conductor tracks should be routed directly and in a straight line (with as few changes in direction of the high-current connections as possible). Branches in the copper profiles can be realized via etched surfaces.
Copper profiles are available in four widths: 2, 4, 8 and 12 mm with a variable length, but this should not be less than 15 mm.
The distance between the profiles should be at least 2.20 mm.
Changing layers of copper profiles from inner layers to outer layers (and back again) is no problem with through-hole plating.
The high-current PCBs are suitable for all common connection contacts: screw, pressure contact, press-fit or soldering.
Microvias and thermovias can be used to thermally connect the copper profiles to a heat sink. Conductor widths, residual rings and aspect ratios must be observed so that a sufficient amount of copper is deposited. A minimum copper thickness of 20 µm must be achieved in the hole.
As the power components become hotter than the high-current conductor, a thermally optimized design is required.
English 
German