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Guide to PCB design - The Digital Design Compass - an interview with Eugen Köhler (RAFI)

Preview Digital Design Compass

The rapid development of the electronics industry requires increasingly efficient tools and technologies in order to meet the growing demands. With our Digital Design Compass, we - the KSG Group - have brought to life a free online tool with helpful operating functions that is available around the clock. The platform supports PCB design and can be used in German and English [...]

The cost-optimized PCB - Part 2: Savings potential in pressing, drilling & milling

On the way to a cost-efficient PCB, it is not only the utilization and selection of materials - as described in Part 1 - that play a role. There is also potential for savings in the mechanical machining processes. In particular, it is important to reduce throughput times for pressing, drilling and milling. Enabling cost-efficient pressing processes The pressing process is primarily influenced by cost [...]

PCB marking shapes the future of smart production

Printed circuit board with fingerprint

Today we dive into the world of PCB marking and discover its importance in the context of Industry 4.0 and Smart Factory. In an era where technology and production are seamlessly merging, markings are not just simple information, but the input that paves the way for efficient, intelligent and state-of-the-art manufacturing. Let us [...]

#smartertogether for over 30 years: GE HealthCare and KSG Group in harmony with progress and quality

In a fast-moving world, trusting business partnerships are rare. So how is it possible to build and maintain a strong customer-supplier relationship over 30 years? One example of this is the successful collaboration between GE HealthCare and us, the KSG Group. We have been producing PCBs suitable for series production for various industries for over 64 years. Our high-quality KSG printed circuit boards are used in the [...]

Solar car from Agoria Solar: How a KSG printed circuit board helped set a world record

Agoria Solar in South Africa

Sustainable mobility is one of the most important areas of development: Solar cars can cover long distances without any charging breaks. Students from the Belgian Agoria Solar Team from Leuven managed to set records with a KSG circuit board. In the blog article, team captain Mathieu Peeters explains how KSG was able to make an important contribution to the development of the solar car with an Iceberg® PCB. Mr. Peeters, if someone [...]

3D printed circuit boards: three technologies, three examples (Part 3)

HSMtec-3D printed circuit board

HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require flex foil at the bending point. This technology uses copper wires and copper profiles pressed into the FR4 material of the multilayer as the bendable material. The FR4 is removed at the bending edges with notches. Individual segments can be aligned at these predetermined bending points with an angle of inclination of up to ±90°. [...]

3D printed circuit boards: three technologies, three examples (Part 2)

The semi-flexible PCB construction is bent twice by 90° and carries 195 electrical connections across the two semi-flexible areas.

Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is a low-cost alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The movable areas are created by deep milling in the FR4 PCB, the remaining thickness is only approx. 150 µm. The printed circuit board in this area, together with the [...]

3D printed circuit boards: three technologies, three examples (Part 1)

HSMtec 3D printed circuit board

Three-dimensional PCBs make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as their advantages and limitations. Increase the packing density, reduce the weight and at the same time increase the reliability of the assemblies [...]

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