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Multilayer PCBs with four or more copper layers are used in almost all areas of electronics.
Rewiring is possible on up to 30 layers.
The miniaturization of electronic devices requires the implementation of more and more functionalities in less and less space. At the same time, the density of components on a circuit board is increasing.
Multilayer PCBs with four or more copper layers are therefore used in almost all areas of electronics. Rewiring is possible on up to 30 layers, which are generally connected with through-hole plating. Thicknesses of up to 3.20 mm are possible in PCB production.
The main challenge with multilayer PCBs and their structure is the optimal handling of the very thin layers of material. Fully automated production processes ensure consistent quality, even with high layer multilayers.
Our precisely designed registration processes guarantee maximum congruence of all layers - even with the finest structures. With insulation thicknesses starting at 50 μm for cores and prepregs, the layer structure can be customized for many electrical requirements (EMC, impedance, etc.).
Intelligent software is used to calculate the resin filling and insulation thicknesses for the layer structures. Cost and quality optimizations can also be carried out
| Number of layers | 4 – 30 |
| PCB thickness | 0.50 - 3.20mm |
| Materials | FR4, hybrid of various FR4s possible |
| Glass transition temperature Base material | 135°C; 150°C; 170/180°C |
| Aspect ratio vias | ≤ 1:10 |
The specified values represent the maximum power spectrum and may be limited in certain combinations.
Solder resist masks
Additional prints
Edge metallization
In order to improve the EMC protection of a circuit board, to create an electrical contact to the housing of the assembly or to meet increased cleanliness requirements, the front sides of the circuit board contour can be metallized.
Milled vias
It is possible to produce application-specific components with so-called milled through-holes. The resulting circuit boards can be soldered onto another circuit board as components (interposer) due to their front-side contacting option.
Contour processing
Contour production: milling and scoring
Targeted adaptation of panel frames or minor changes to the PCB size enable savings to be made by increasing the space utilization of our production panels. You can find the usable net area of our production panels in our PCB Design Compass.
The smart platform for fast and reliable PCB development.
We have bundled all the parameters for you in our Design Compass.
Take advantage of the direct line to the experienced PCB experts in our technical support team. We are happy to support you in every phase of your project.
Talk to us in the early development phases of your project and contact our team of experts. Together we will find the solution that will make your product even better.
With a workshop at our premises or at your site, we give you the opportunity to discuss the key technical aspects and features of your project in detail.
From design and layout checks to various calculations and thermal analyses - the experienced, competent Technical Support team will be happy to help you.
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