Plugging
Plugging, hole filling, microvia copper filling or via hole plugging refers to the filling of metallized through-holes or metallized blind holes on the outer layers of the PCB. This achieves a planar surface topography, even with highly complex circuit carriers, which can significantly increase process safety and reliability in the assembly process, no solder run-off, no air inclusions. The result is filled-and-capped vias. These vias [...]
Storing PCBs correctly: the most important tips
Incorrect handling and improper storage of PCBs can have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards and later electronic assemblies, reduce solderability and affect the electrical test. Moisture absorbed in base materials can cause internal delamination, warping and warping or excessive stresses in the through-hole metallization. The reason: During soldering, the absorbed [...]
3D printed circuit boards: three technologies, three examples (Part 3)
HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require flex foil at the bending point. This technology uses copper wires and copper profiles pressed into the FR4 material of the multilayer as the bendable material. The FR4 is removed at the bending edges with notches. Individual segments can be aligned at these predetermined bending points with an angle of inclination of up to ±90°. [...]
3D printed circuit boards: three technologies, three examples (Part 2)
Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is a low-cost alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The movable areas are created by deep milling in the FR4 PCB, the remaining thickness is only approx. 150 µm. The printed circuit board in this area, together with the [...]
3D printed circuit boards: three technologies, three examples (Part 1)
Three-dimensional PCBs make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as their advantages and limitations. Increase the packing density, reduce the weight and at the same time increase the reliability of the assemblies [...]
HSMtec®
In the HSMtec® process, 500 µm thick copper elements with variable widths of 2 to 12 mm and individual lengths are placed in the inner layers of the multilayer and embedded in the PCB. Thanks to the partial integration of copper profiles into the PCB, high-current paths - or thermal management and fine conductor layout - can be easily combined and adapted to the spatial conditions. [...]
HDI/SBU printed circuit boards
The abbreviation HDI stands for High Density Interconnect and refers to multilayer PCBs with four or more layers, which are built up sequentially in several pressing processes (Sequential Build Up, abbreviated: SBU). With this structure, high wiring and placement densities for high-pole active components can be realized on an electronic assembly. Typical for an HDI PCB is [...]
A look at the roadmap for the European PCB industry
Multifunctional system boards are already state of the art today. Different base materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, HF-capable, high-current capable, heat-optimized and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB technology and where the journey is heading. The development of PCB technology has been and continues to be driven by the development of electronic components [...]
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