This year, PCB manufacturer KSG has invested around 11.6 million euros in its two plants in Gornsdorf and Gars am Kamp. In addition to expanding its production capacities, KSG is also expanding its process technology for high-speed RF and HDI/SBU PCBs.
"With this year's investments, we are expanding our expertise in HDI/SBU printed circuit boards (High Density Interconnection/Sequential Built Up) and continuing our course for security of supply, high product quality and flexibility," says Swen Klöden, CTO. We have invested around 10.8 million euros in the Gornsdorf plant in Saxony and further expanded production capacity at the Gars am Kamp plant in Lower Austria with around 800,000 euros.
With extensive, demand-oriented investments totaling EUR 35.3 million, KSG has already converted the two sites into high-end production facilities and expanded production capacity at the Gars plant over the past three years. This year, the largest investment projects are focused on expanding technological capabilities, increasing capacity and enhancing process reliability in key processes. These include the installation of the plugging process for filling drill holes and blind holes, an additional laser drilling machine and the installation of a measuring machine for conductor voltage measurement of highly complex antenna structures.
Security of supply and technology expansion for HDI/SBU multilayers
Our process experts in Gornsdorf have also planned an SES plant (stripping/etching/stripping), a copper recycling plant and an electroplating plant, which are due to be installed in 2021. This will provide security of supply coupled with technological expansion for the reliable production of highly complex HDI/SBU assemblies. The higher integration densities possible with this process offer PCB designers considerable space savings and fewer restrictions when laying out complex circuits.
"Semiconductors continue to drive the development of PCB technology. For us, this means that we have to continue to perfect the properties of PCBs with ever smaller dimensions," emphasizes Klöden. Twelve-layer HDI multilayers with a line/space of 100 µm and smaller are state of the art in Europe today.
Optimized signal integrity requires an even higher integration density. This forces PCB designers to combine impedance-controlled multilayers with layer structures larger than twelve layers with complex SBU structures 3+x+3 and fine-pitch patterns smaller than 75/75 µm line/space. Rewiring strategies with pluggable, staggered or stacked microvia arrangements are becoming increasingly important in the routing of fine-pitch BGA structures with several hundred connections on the underside.
English 
German