The PCB manufacturer KSG has introduced the plugging process for filling through-holes and blind holes in its production. The higher integration densities possible with plugging lead to considerable space savings in SBU structures (SBU: sequential structure) and therefore to fewer restrictions in the layout design of complex circuits ("via in pad" or "staggered/stacked microvia on buried via" technology).
KSG has opted for full-surface, vertical vacuum filling due to the wide range of applications. In addition to through-holes, this process can also be used to fill mechanically or laser-drilled blind holes quickly, reliably and with consistent reproducibility, making it suitable for a wide range of applications. Further advantages over the conventional screen printing process are the bubble-free filling of the drill holes, high flexibility, lower paste consumption and the filling of drill holes with more demanding drill hole depths.
With the in-house process, we are expanding our capacities in addition to the existing option of external services. This increases our flexibility, which is entirely in the interests of our customers," explains Christof Sofsky, Sales Manager at KSG.
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