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Iceberg®-PCBs are characterized by structures with mixed copper thicknesses from 105 to 400 µm in outer layers - with a uniform surface topography. High currents and fine conductors can be efficiently combined in a multilayer with optional inner layers.
Increasingly powerful components require more and more power and emit more and more heat loss. To ensure the reliability of the circuit in the long term, the printed circuit board must also meet these requirements. Thick copper/iceberg®-PCBs are characterized by structures with mixed copper thicknesses of 105 to 400 µm in outer layers - with a uniform surface topography. High currents and fine conductors can therefore be efficiently combined in a multilayer together with additional optional inner layers.
These circuit boards are used for large (high) current outputs and for cooling for good thermal management. This is because the copper favors heat dissipation. They are usually designed as multilayer boards.
Whether thermal management or current carrying capacity, thick copper and know-how are required here. KSG can provide you with both to suit your project.
| Materials | FR4 (thermostable) |
| Number of layers | 2 – 8 |
| PCB thickness | 1.5 mm - 3.2 mm |
| End copper outer layers | 105 and 400 µm |
| End copper inner layers | 18, 35, 70, 105, 210 µm |
| Ladder structures | Depending on the end copper according to Design Compass |
| Smallest drill diameter | min. ⅔ of the total copper thickness |
| Aspect Ratio | ≤ 1:6 |
| Surfaces |
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The specified values represent the maximum power spectrum and may be limited in certain combinations.
Solder resist masks
Additional prints
Edge metallization
In order to improve the EMC protection of a circuit board, to create an electrical contact to the housing of the assembly or to meet increased cleanliness requirements, the front sides of the circuit board contour can be metallized.
Milled vias
It is possible to produce application-specific components with so-called milled through-holes. The resulting circuit boards can be soldered onto another circuit board as components (interposer) due to their front-side contacting option.
Contour processing
Contour production: milling and scoring
Microvias (lasered) on outer layers
Microvias (lasered) in combination with plated-through laminates (mechanically drilled)
Microvias (lasered) in combination with buried vias (mechanically drilled)
Staggered microvias (lasered) in combination with buried vias (mechanically drilled) - from L2 to Ln-1
Staggered microvias (lasered) in combination with buried vias (mechanically drilled) - from L3 to Ln-2
Stacked microvias (lasered) with microvia copper filling in combination with buried vias (mechanically drilled)
Double Core
The smart platform for fast and reliable PCB development.
We have bundled all the parameters for you in our Design Compass.
Talk to us in the early development phases of your project and contact our team of experts. Together we will find the solution that will make your product even better.
With a workshop at our premises or at your site, we give you the opportunity to discuss the key technical aspects and features of your project in detail.
From design and layout checks to various calculations and thermal analyses - the experienced, competent Technical Support team will be happy to help you.
Iceberg®-PCBs are partial thick copper PCBs with mixed copper thicknesses of 105 and 400 µm on the same level in the outer layers. Around two thirds of the thick copper is embedded in the base material. The "sinking" of the thick copper structures in the base material enables a uniform surface topography despite different copper thicknesses on the same layer. This means that the conductor flanks can be reliably covered with solder resist in just one casting process.
Due to its planar surface, which simplifies loading, the Iceberg®-principle for thick copper PCBs with a copper cladding >250 µm on the outer layers. Iceberg®structures are also suitable as heat sinks for power components and can be combined with plated-through holes (vias) to optimize thermal management. In a wiring level, there are areas with 70 to 105 µm copper for the control electronics and areas with 400 µm copper for the load. This makes it possible to combine large cross-sections for high currents and fine conductors in a multilayer with optional inner layers. On the inner layers, the Iceberg®-principle can also be combined with thick copper.
The advantages of the Iceberg®-technology are:
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