HSMtec®
In the HSMtec® process, 500 µm thick copper elements with variable widths of 2 to 12 mm and individual lengths are inserted into the
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In the HSMtec® process, 500 µm thick copper elements with variable widths of 2 to 12 mm and individual lengths are inserted into the
The abbreviation HDI stands for High Density Interconnect and refers to multilayer printed circuit boards with four or more layers that are connected in
The printed circuit board manufacturer KSG has invested around 11.6 million euros this year in its two plants in Gornsdorf and Gars am
Multifunctional system circuit boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly
The PCB manufacturer KSG has introduced the plugging process for filling through-holes and blind holes in its production. The plugging
pcb-blog is the name of the new company blog of the PCB specialist KSG, which has been online since April. Everything here revolves around the printed circuit board:
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