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Since 2002, a team of experts at KSG has been researching and developing printed circuit board technology independently of production. This team meets the challenges of increasingly complex market requirements for PCB technology, product and process quality and an economical cost structure with interdisciplinary and wide-ranging expertise.
stehen unseren Kunden zur technischen Unterstützung in allen Fragen rund um die Leiterplattentechnologie zur Verfügung und teilen ihr Know-how auf Kongressen, Fachforen und Online-Seminaren mit interessierten Kunden.
We always have sporty shoes ready - for the extra mile in the realization of your ideas. Bringing your product to market or perfecting it is our goal. That's what drives us. It fills us with passion. That's where our compass points. Every day.
have been implemented in the last 3 years as part of government-funded cooperation and joint projects together with our customers, industrial partners, research institutes and universities.
Erleben Sie es selbst und lassen Sie sich von unserer Begeisterung mitreißen. Wir finden Lösungen, wo herkömmliche Technologien nicht ausreichen. Mit unserer standortübergreifenden Forschungs- und Entwicklungsabteilung gehen wir neue Wege. Denn: Was es noch nie gab, entwickelt man nicht mit Methoden, die es schon gibt.
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Target: Development of a highly integrated IoT radio sensor module for networked monitoring of operating states during production and the product life cycle.
KSG challenge: Development of an embedded technology for a miniaturized IoT sensor circuit carrier
Contents: The aim of the PCB 4.0 research project is to create a technology platform for the design and manufacture of embedded miniaturized wireless sensor nodes and their integration into production processes. In addition to design methods and module and assembly concepts, the partners are also developing strategies for series production. The performance of the developed technologies is to be demonstrated using wireless sensor layers which, integrated into printed circuit boards, record and process the actual status in the production of industrial electronics in real time. Self-diagnosis methods allow for seamless condition-based maintenance of the production process. The successful implementation of the project task, the integration of the electronics into the PCB composite, has enabled KSG to further expand its expertise in the field of embedded technology.
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3D model of a sensor beacon for 3-axis acceleration and ambient conditions (Sensorik Bayern)
X-ray image of a highly miniaturized version for ambient conditions (TUB, KSG)
Target: Development of a high-resolution radar system with integrated AI-supported data processing for cooperative autonomous driving
KSG challenge: Development of an embedding technology for the AI radar sensor with system-integrated planar antenna or autonomous SMD-mountable 3D antenna
ContentsThe AI Radar project aims to increase the resolution of radar sensors using AI methods and innovative antenna geometries. Using AI algorithms, the measured values of individual radar sensors are to be coupled with each other in near real time, thereby significantly increasing the resolution and safety of the sensor technology as a whole. Novel three-dimensional antenna structures will also be used to extend the detection range of the radar sensors. The project is researching the development of decentralized data processing in the sensors in order to achieve miniaturization of the electronic components. In order to further increase safety, information from the immediate surroundings will be incorporated to improve the detection of stationary traffic.
In addition to through-holes, laser vias and internal holes (buried vias) are used for the connection to and on the inner copper layers. For a higher number of layers combined with an HDI design, the use of PCB base material with optimized Z-axis expansion is recommended.
Partner:
Target: Development of a highly efficient solar cell concept for an economically viable series product
KSG challenge: Development of locally acting electrochemical structuring processes for thin metal layers, in particular aluminum layers (0.3-5 µm), which can produce layout structures with a space of up to 50 µm, as required for applications on solar cells.
ContentsThe two processes "electrochemical screen printing" (EC screen printing) and "electrochemical dispensing" (EC dispensing) were pursued for the microstructuring of aluminum-laminated PCB material. Alternatively, the selective laser ablation process and the process for wet-chemical aluminum structuring with the FeCl3 etching system, which is established in other industries, were investigated.
Partner:
Target: Research into an innovative inductive energy transmission system for autonomous electric drives as a key technology for the Industry 4.0 use of highly flexible actuators.
KSG challenge: Development of a PCB technology for the integration of high-performance coils by integrating RF strands in cavities in a 20-layer hybrid FR4-HF multilayer structure with conductor pattern structures < 50 µm line/space.
ContentsIn automation technology, there are some challenging applications that require hermetic sealing of automatic machines, such as placement robots in the semiconductor industry or in medical technology. Classic cable drags or sliding contacts often cannot be used due to the requirements. The energy must then be transmitted wirelessly to the actuators in the machines. The INDUGIE project therefore aims to research innovative contactless energy transmission systems. These should be able to transmit high electrical power inductively in a variety of forms, e.g. flat, point or linear, and thus be able to supply a wide range of actuators with energy simultaneously.
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