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The use of cost-effective PCB technologies based on standard FR4 base material is still sufficient for many applications. Double-sided PCBs manufactured in this way map their layout on two plated-through copper layers.
Why choose complex PCB technologies when double-sided PCBs are simpler and more cost-effective? For many applications, e.g. in industrial electronics or the automotive sector, the use of cost-effective PCB technologies based on standard FR4 base material is still sufficient. PCBs manufactured in this way have a layout on two plated-through copper layers.
| Materials | FR4, PTFE |
| PCB thickness | 0.5 mm - 3.20 mm |
| End copper | 18 - 210 µm |
| Ladder structures | ≥ 70/80 µm |
| Smallest drill diameter | 0.2 mm |
| Aspect Ratio | ≤ 1:10 |
The specified values represent the maximum power spectrum and may be limited in certain combinations.
Solder resist masks
Additional prints
Edge metallization
In order to improve the EMC protection of a circuit board, to create an electrical contact to the housing of the assembly or to meet increased cleanliness requirements, the front sides of the circuit board contour can be metallized.
Milled vias
It is possible to produce application-specific components with so-called milled through-holes. The resulting circuit boards can be soldered onto another circuit board as components (interposer) due to their front-side contacting option.
Contour processing
Contour production: milling and scoring
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